Wetness Tester SP-2
It is a wettability testing device that employs the SP tension method (profile heating method).
SP-2 is a wettability testing device for solder paste, component electrodes, and printed circuit boards in surface mounting, employing the SP tension method (profile heating method). The entire wettability process can be observed through a glass window. With a preheat function and built-in powerful heater, it can achieve the same or optimal temperature profile as in actual reflow processes. Additionally, by adopting an electro-balance sensor that enables the detection of smaller forces, it allows for the evaluation of the wettability of microchip components sized 1005 and 0603. Conditions can be set and input, measurement operations conducted, and results such as wetting time and wetting force automatically analyzed using a computer (with dedicated software). Evaluation tests for wire solder are also possible. Furthermore, measurements using the wetting balance method, micro-wetting balance method, and rapid heating method can be performed (optional). It is ideal for wettability evaluation related to lead-free solder (paste, components, temperature conditions). For more details, please contact us or refer to the catalog.
- Company：マルコム
- Price：Other
